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July 23 (Reuters) - Amkor Technology said on Thursday it had entered a multi-year agreement ‌with Nvidia worth $1.5 billion to expand ‌advanced semiconductor packaging and test capacity in the U.S., as ​the chip industry races to build out AI infrastructure.

Shares of the semiconductor packaging company jumped 17% in extended trading.

Here are a few details ‌on the partnership:

• ⁠Under the agreement, Nvidia will make a prepayment to support the expansion ⁠of Amkor's U.S. advanced packaging operations, including capacity in Arizona.

• The companies will jointly develop ​packaging and ​testing technologies for Nvidia's ​AI and accelerated-computing ‌platforms, focusing on combining different types of chips in a single package.

• Amkor already supplies advanced packaging for Nvidia's product portfolio, including data center processors, and the expanded deal aims to ‌bring new packaging technologies ​to market as AI infrastructure ​demand grows.

• In ​June, Amkor entered a 10-year partnership ‌with TSMC, the world's ​largest contract ​chipmaker, to enhance semiconductor packaging capabilities in the United States.

• Amkor is also working ​with Advanced Micro ‌Devices to package the semiconductor company's ​chips.

(Reporting by Juby Babu in Mexico City; ​Editing by Pooja Desai)